Техническая документация
Характеристики
Brand
STMicroelectronicsТип продукции
Отладочный набор управления питанием
Функция управления мощностью
Управление питанием
Для использования с
High Side Driver
Классификация комплектов
Оценочная плата
Представленное устройство
VNI8200XP
Наименование комплекта
Демонстрационная плата
Стандарты/одобрения
RoHS
Страна происхождения
Italy
Информация о товаре
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The boards isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
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Техническая документация
Характеристики
Brand
STMicroelectronicsТип продукции
Отладочный набор управления питанием
Функция управления мощностью
Управление питанием
Для использования с
High Side Driver
Классификация комплектов
Оценочная плата
Представленное устройство
VNI8200XP
Наименование комплекта
Демонстрационная плата
Стандарты/одобрения
RoHS
Страна происхождения
Italy
Информация о товаре
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The boards isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.