Heatsink BGA 20x20 22K/W anodised

RS PRO Heatsink - Adhesive Foil, 23 mm x 23 mm x 6 mm

The RS PRO standard BGA (Ball Grid Array) Push Pin heatsink is meticulously designed for superior performance and precision, seamlessly integrating into your electronic systems. This heatsink serves as a crucial element in preventing circuits from overheating, thereby ensuring the consistent and reliable performance of your electronic devices.;Crafted from aluminium with a durable anodized finish, this heatsink offers excellent heat dissipation capabilities. Its secure mounting, facilitated by adhesive foil, provides a stable and efficient connection to electronic components.

Why Would You Choose This Heatsink?

The RS PRO Heatsink plays a vital role in maintaining optimal operating temperatures for your electronic components, safeguarding them against the risks of overheating. As electronic components generate heat during operation, the heatsink effectively absorbs and dissipates this heat, preventing the accumulation that could otherwise lead to damage or a decline in component performance. Invest in the RS PRO Heatsink for enhanced thermal management and prolonged durability of your electronic devices.

Features and Benefits

• BGA heatsink
• Standard, Pushpin
• Made from aluminium
• Adhesive foil mounting
• Anodized finish
• For use with Universal rectangular Alu
• Thermal resistance 22.0° C/W

Dimensions

• 23 mm x 23 mm x 6mm

Applications

• Integrated Circuits
• PCB

BGA Heatsink, Standard

Standard type BGA heatsink suitable for a variety of applications.

BGA Heatsinks