Техническая документация
Характеристики
Brand
MolexТип продукции
Штыревой разъем печатной платы
Серия
Micro-Fit 3.0
Шаг
3.0мм
Ток
8.5A
Количество контактов
12
Количество рядов
2
Ориентация
Прямой угол
Закрытый/Открытый
Закрытый
Тип монтажа
Поверхность
Блок преобразования клеммы разъема
Провод-плата
Материал контактов
Латунь
Покрытие контактов
Золотой
Напряжение
250 V
Информация о товаре
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Информация о наличии не успела загрузиться
тг 4 626,45
тг 925,29 Each (In a Pack of 5) (ex VAT)
Стандартная упаковка
5
тг 4 626,45
тг 925,29 Each (In a Pack of 5) (ex VAT)
Информация о наличии не успела загрузиться
Стандартная упаковка
5
| Количество | Цена единицы | Per Упаковка |
|---|---|---|
| 5 - 95 | тг 925,29 | тг 4 626,45 |
| 100 - 370 | тг 844,83 | тг 4 224,15 |
| 375 - 1495 | тг 791,19 | тг 3 955,95 |
| 1500 - 2995 | тг 755,43 | тг 3 777,15 |
| 3000+ | тг 724,14 | тг 3 620,70 |
Техническая документация
Характеристики
Brand
MolexТип продукции
Штыревой разъем печатной платы
Серия
Micro-Fit 3.0
Шаг
3.0мм
Ток
8.5A
Количество контактов
12
Количество рядов
2
Ориентация
Прямой угол
Закрытый/Открытый
Закрытый
Тип монтажа
Поверхность
Блок преобразования клеммы разъема
Провод-плата
Материал контактов
Латунь
Покрытие контактов
Золотой
Напряжение
250 V
Информация о товаре
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals