Техническая документация
Характеристики
Brand
MolexТип продукции
Штыревой разъем печатной платы
Серия
Micro-Fit 3.0
Шаг
3мм
Ток
8.5A
Количество контактов
4
Материал корпуса
Термопластик
Количество рядов
2
Ориентация
Прямой угол
Закрытый/Открытый
Закрытый
Блок преобразования клеммы разъема
Провод-плата
Тип монтажа
Поверхность
Материал контактов
Латунь
Покрытие контактов
Олово
Минимальная рабочая температура
-40°C
Шаг отверстий
3мм
Тип оконцовки
Припой
Контакт - тип соединителя
Вилка
Максимальная рабочая температура
105°C
Длина контактной части
3мм
Стандарты/одобрения
EU RoHS, Low-Halogen, REACH SVHC, UL E29179
Напряжение
600V
Информация о товаре
This PCB Header is designed for reliable surface mount applications. With dimensions suited for various circuit requirements, it features a right-angle orientation and a dual-row configuration, facilitating space-efficient layouts in compact electronic devices.
It operates effectively within a temperature range of -40 to +105 °C, making it suitable for a variety of environments where temperature fluctuations occur.
The glow wire compatibility indicates that the connector can withstand high temperatures without igniting, ensuring safe operation in household and similar electrical appliances.
The contacts are made of brass and plated with tin, providing good electrical conductivity and protection against corrosion, enhancing overall connector performance.
It is tested according to international standards, including IEC 60695 for heat and fire resistance, ensuring it meets stringent safety and quality criteria.
The connector offers a durability of up to 30 mating cycles, ensuring long-lasting performance in repeated connections.
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Информация о наличии не успела загрузиться
P.O.A.
Each (Supplied on a Reel) (ex VAT)
Производственная упаковка (Катушка )
5
P.O.A.
Each (Supplied on a Reel) (ex VAT)
Информация о наличии не успела загрузиться
Производственная упаковка (Катушка )
5
Техническая документация
Характеристики
Brand
MolexТип продукции
Штыревой разъем печатной платы
Серия
Micro-Fit 3.0
Шаг
3мм
Ток
8.5A
Количество контактов
4
Материал корпуса
Термопластик
Количество рядов
2
Ориентация
Прямой угол
Закрытый/Открытый
Закрытый
Блок преобразования клеммы разъема
Провод-плата
Тип монтажа
Поверхность
Материал контактов
Латунь
Покрытие контактов
Олово
Минимальная рабочая температура
-40°C
Шаг отверстий
3мм
Тип оконцовки
Припой
Контакт - тип соединителя
Вилка
Максимальная рабочая температура
105°C
Длина контактной части
3мм
Стандарты/одобрения
EU RoHS, Low-Halogen, REACH SVHC, UL E29179
Напряжение
600V
Информация о товаре
This PCB Header is designed for reliable surface mount applications. With dimensions suited for various circuit requirements, it features a right-angle orientation and a dual-row configuration, facilitating space-efficient layouts in compact electronic devices.
It operates effectively within a temperature range of -40 to +105 °C, making it suitable for a variety of environments where temperature fluctuations occur.
The glow wire compatibility indicates that the connector can withstand high temperatures without igniting, ensuring safe operation in household and similar electrical appliances.
The contacts are made of brass and plated with tin, providing good electrical conductivity and protection against corrosion, enhancing overall connector performance.
It is tested according to international standards, including IEC 60695 for heat and fire resistance, ensuring it meets stringent safety and quality criteria.
The connector offers a durability of up to 30 mating cycles, ensuring long-lasting performance in repeated connections.
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals