Техническая документация
Характеристики
Brand
MolexСерия
Micro-Fit 3.0
Тип продукции
Штыревой разъем печатной платы
Ток
5A
Шаг
3мм
Материал корпуса
Высокотемпературный термопластик
Количество контактов
4
Количество рядов
2
Ориентация
Прямой угол
Закрытый/Открытый
Закрытый
Блок преобразования клеммы разъема
Провод-плата
Тип монтажа
Поверхность
Материал контактов
Латунь
Покрытие контактов
Олово
Минимальная рабочая температура
-40°C
Шаг отверстий
3мм
Тип оконцовки
Припой
Контакт - тип соединителя
Вилка
Максимальная рабочая температура
105°C
Стандарты/одобрения
Нет
Длина контактной части
3мм
Напряжение
250 V
Информация о товаре
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Информация о наличии не успела загрузиться
тг 3 911,25
тг 782,25 Each (In a Pack of 5) (ex VAT)
5
тг 3 911,25
тг 782,25 Each (In a Pack of 5) (ex VAT)
Информация о наличии не успела загрузиться
5
| Количество | Цена единицы | Per Упаковка |
|---|---|---|
| 5 - 95 | тг 782,25 | тг 3 911,25 |
| 100 - 370 | тг 697,32 | тг 3 486,60 |
| 375 - 1495 | тг 612,39 | тг 3 061,95 |
| 1500 - 2995 | тг 527,46 | тг 2 637,30 |
| 3000+ | тг 442,53 | тг 2 212,65 |
Техническая документация
Характеристики
Brand
MolexСерия
Micro-Fit 3.0
Тип продукции
Штыревой разъем печатной платы
Ток
5A
Шаг
3мм
Материал корпуса
Высокотемпературный термопластик
Количество контактов
4
Количество рядов
2
Ориентация
Прямой угол
Закрытый/Открытый
Закрытый
Блок преобразования клеммы разъема
Провод-плата
Тип монтажа
Поверхность
Материал контактов
Латунь
Покрытие контактов
Олово
Минимальная рабочая температура
-40°C
Шаг отверстий
3мм
Тип оконцовки
Припой
Контакт - тип соединителя
Вилка
Максимальная рабочая температура
105°C
Стандарты/одобрения
Нет
Длина контактной части
3мм
Напряжение
250 V
Информация о товаре
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals