Hirose DF59-4P-2C Корпус разъема

Hirose 2 mm DF59 Series Crimp Socket Housings

2 mm DF59 Series wire to board crimp socket housings with a compact space saving design and a low profile mating height of 2.48 mm. These DF59 crimp housings use a swing lock mechanism when mated which incorporates both positive and friction locks. A positive locking mechanism secures the housing to the header providing a tactile click when the lock is securely engaged. A complete electrical connection is then made by the friction lock mechanism which also produces a tactile click when fully engaged. This swing lock mechanism provides a secure connection and prevents accidental unmating caused by severe wiring and mechanical stress. The contacts for these DF59 series crimp housings must be purchased separately.

Hirose DF59 Series

The Hirose DF59 series features a low profile design that minimises shadowing and a positive swing-lock engagement, which provides strong plug retention against cable pull. Additionally, the Hirose DF59 series offers a floating board-to-board connector which allows ± 0.5mm floating function in XYZ directions, reducing contact stress. With the Hirose DF59 series, multiple board-to-board connections are possible, minimizing the issue of thermal expansion and reducing component quantity. Applications include LED lighting, power supplies, battery connection and small DC motor drives.