TE Connectivity AMPMODU System 50 Series Straight Surface Mount PCB Socket, 40-Contact, 2-Row, 1.27mm Pitch, Solder
Техническая документация
Характеристики
Brand
TE ConnectivityКоличество контактов
40
Количество рядов
2
Шаг
1.27мм
Тип
Разветвитель питания с розетками
Тип монтажа
Поверхностный монтаж
Ориентация корпуса
Прямой
Метод оконцовки
Припой
Номинальный ток
12A
Номинальное напряжение
30,0 В
Серия
AMPMODU System 50
Материал контактов
Медь
Страна происхождения
United States
Информация о товаре
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.
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P.O.A.
17
P.O.A.
17
Техническая документация
Характеристики
Brand
TE ConnectivityКоличество контактов
40
Количество рядов
2
Шаг
1.27мм
Тип
Разветвитель питания с розетками
Тип монтажа
Поверхностный монтаж
Ориентация корпуса
Прямой
Метод оконцовки
Припой
Номинальный ток
12A
Номинальное напряжение
30,0 В
Серия
AMPMODU System 50
Материал контактов
Медь
Страна происхождения
United States
Информация о товаре
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.