Техническая документация
Характеристики
Brand
TE ConnectivityДлина
41мм
Ширина
16мм
Глубина
0.075мм
Минимальная рабочая температура
0°C
Максимальная рабочая температура
+70°C
Размеры
41 (мм) x 16 (мм) x 75 (мкм)
Информация о товаре
TE Connectivity SDT Series Shielded Piezo Vibration Sensors
TE Connectivitys MEAS SDT series are piezoelectric sensors constructed with a folded film element printed with silver ink attached to moulded plastic housing with an 18 coaxial cable. The folded element self-shields the transducer area, which for high EMI environments is particularly important. Using glue or epoxy, these piezoresistive vibration sensors can be adhered directly to surfaces.
Suitable applications include vibration/impact sensing, acoustic pickup, vibration analysis for equipment and product design, contact microphones, machine monitoring, acoustic emission detection and machine tool chatter detection.
Информация о наличии не успела загрузиться
тг 13 561,98
тг 13 561,98 Each (ex VAT)
Стандартная упаковка
1
тг 13 561,98
тг 13 561,98 Each (ex VAT)
Информация о наличии не успела загрузиться
Стандартная упаковка
1
| Количество | Цена единицы |
|---|---|
| 1 - 9 | тг 13 561,98 |
| 10 - 49 | тг 11 769,51 |
| 50 - 99 | тг 10 620,72 |
| 100 - 149 | тг 9 270,78 |
| 150+ | тг 7 639,23 |
Техническая документация
Характеристики
Brand
TE ConnectivityДлина
41мм
Ширина
16мм
Глубина
0.075мм
Минимальная рабочая температура
0°C
Максимальная рабочая температура
+70°C
Размеры
41 (мм) x 16 (мм) x 75 (мкм)
Информация о товаре
TE Connectivity SDT Series Shielded Piezo Vibration Sensors
TE Connectivitys MEAS SDT series are piezoelectric sensors constructed with a folded film element printed with silver ink attached to moulded plastic housing with an 18 coaxial cable. The folded element self-shields the transducer area, which for high EMI environments is particularly important. Using glue or epoxy, these piezoresistive vibration sensors can be adhered directly to surfaces.
Suitable applications include vibration/impact sensing, acoustic pickup, vibration analysis for equipment and product design, contact microphones, machine monitoring, acoustic emission detection and machine tool chatter detection.
