Heatsink 1.65K/W 88x75x35mm

Non Standard Extrusion 88mm Wide x 35mm High With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.