Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Код товара RS: 447-6906Бренд: MolexПарт-номер производителя: 43650-0415
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Техническая документация

Характеристики

Brand

Molex

Серия

Micro-Fit 3.0

Тип продукции

Штыревой разъем печатной платы

Шаг

3мм

Ток

8.5A

Количество контактов

4

Материал корпуса

Термопластик

Количество рядов

1

Ориентация

Вертикальный

Закрытый/Открытый

Закрытый

Блок преобразования клеммы разъема

Провод-плата

Тип монтажа

Сквозное отверстие

Материал контактов

Латунь

Покрытие контактов

Олово

Минимальная рабочая температура

-40°C

Шаг отверстий

3мм

Тип оконцовки

Припой

Контакт - тип соединителя

Вилка

Максимальная рабочая температура

105°C

Стандарты/одобрения

Нет

Напряжение

600 V

Distrelec Product Id

304-42-707

Информация о товаре

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Информация о наличии не успела загрузиться

тг 1 229,25

тг 245,85 Each (In a Pack of 5) (ex VAT)

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded
Select packaging type

тг 1 229,25

тг 245,85 Each (In a Pack of 5) (ex VAT)

Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Информация о наличии не успела загрузиться

Select packaging type

КоличествоЦена единицыPer Упаковка
5 - 95тг 245,85тг 1 229,25
100 - 370тг 214,56тг 1 072,80
375 - 1495тг 183,27тг 916,35
1500 - 2995тг 151,98тг 759,90
3000+тг 120,69тг 603,45
Вас может заинтересовать

Техническая документация

Характеристики

Brand

Molex

Серия

Micro-Fit 3.0

Тип продукции

Штыревой разъем печатной платы

Шаг

3мм

Ток

8.5A

Количество контактов

4

Материал корпуса

Термопластик

Количество рядов

1

Ориентация

Вертикальный

Закрытый/Открытый

Закрытый

Блок преобразования клеммы разъема

Провод-плата

Тип монтажа

Сквозное отверстие

Материал контактов

Латунь

Покрытие контактов

Олово

Минимальная рабочая температура

-40°C

Шаг отверстий

3мм

Тип оконцовки

Припой

Контакт - тип соединителя

Вилка

Максимальная рабочая температура

105°C

Стандарты/одобрения

Нет

Напряжение

600 V

Distrelec Product Id

304-42-707

Информация о товаре

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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