2way vertical through hole plated header

Код товара RS: 447-6877PБренд: MolexПарт-номер производителя: 43650-0215
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Техническая документация

Характеристики

Brand

Molex

Серия

Micro-Fit 3.0

Тип продукции

Штыревой разъем печатной платы

Шаг

3мм

Ток

5A

Количество контактов

2

Материал корпуса

Термопластик

Количество рядов

1

Ориентация

Прямой

Закрытый/Открытый

Закрытый

Блок преобразования клеммы разъема

Провод-плата

Тип монтажа

Сквозное отверстие

Материал контактов

Латунь

Покрытие контактов

Олово

Минимальная рабочая температура

-40°C

Шаг отверстий

3мм

Тип оконцовки

Припой

Контакт - тип соединителя

Вилка

Максимальная рабочая температура

105°C

Стандарты/одобрения

Нет

Напряжение

250 V

Информация о товаре

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Информация о наличии не успела загрузиться

P.O.A.

Each (Supplied in a Bag) (ex VAT)

2way vertical through hole plated header
Select packaging type

P.O.A.

Each (Supplied in a Bag) (ex VAT)

2way vertical through hole plated header

Информация о наличии не успела загрузиться

Select packaging type

Техническая документация

Характеристики

Brand

Molex

Серия

Micro-Fit 3.0

Тип продукции

Штыревой разъем печатной платы

Шаг

3мм

Ток

5A

Количество контактов

2

Материал корпуса

Термопластик

Количество рядов

1

Ориентация

Прямой

Закрытый/Открытый

Закрытый

Блок преобразования клеммы разъема

Провод-плата

Тип монтажа

Сквозное отверстие

Материал контактов

Латунь

Покрытие контактов

Олово

Минимальная рабочая температура

-40°C

Шаг отверстий

3мм

Тип оконцовки

Припой

Контакт - тип соединителя

Вилка

Максимальная рабочая температура

105°C

Стандарты/одобрения

Нет

Напряжение

250 V

Информация о товаре

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series