Техническая документация
Характеристики
Brand
MolexТип продукции
Штыревой разъем печатной платы
Серия
Micro-Fit 3.0
Ток
5A
Шаг
3мм
Материал корпуса
Высокотемпературный термопластик
Количество контактов
16
Количество рядов
2
Ориентация
Прямой
Закрытый/Открытый
Закрытый
Блок преобразования клеммы разъема
Провод-плата
Тип монтажа
Сквозное отверстие
Материал контактов
Латунь
Покрытие контактов
Золотой
Шаг отверстий
3мм
Тип оконцовки
Припой
Минимальная рабочая температура
-40°C
Максимальная рабочая температура
125°C
Контакт - тип соединителя
Вилка
Стандарты/одобрения
Нет
Длина контактной части
3мм
Напряжение
250 V
Distrelec Product Id
304-42-680
Информация о товаре
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
Информация о наличии не успела загрузиться
P.O.A.
Each (Supplied in a Bag) (ex VAT)
Производственная упаковка (Сумка)
5
P.O.A.
Each (Supplied in a Bag) (ex VAT)
Информация о наличии не успела загрузиться
Производственная упаковка (Сумка)
5
Техническая документация
Характеристики
Brand
MolexТип продукции
Штыревой разъем печатной платы
Серия
Micro-Fit 3.0
Ток
5A
Шаг
3мм
Материал корпуса
Высокотемпературный термопластик
Количество контактов
16
Количество рядов
2
Ориентация
Прямой
Закрытый/Открытый
Закрытый
Блок преобразования клеммы разъема
Провод-плата
Тип монтажа
Сквозное отверстие
Материал контактов
Латунь
Покрытие контактов
Золотой
Шаг отверстий
3мм
Тип оконцовки
Припой
Минимальная рабочая температура
-40°C
Максимальная рабочая температура
125°C
Контакт - тип соединителя
Вилка
Стандарты/одобрения
Нет
Длина контактной части
3мм
Напряжение
250 V
Distrelec Product Id
304-42-680
Информация о товаре
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
