Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Техническая документация
Характеристики
Brand
BergquistТолщина
0.001дюйм
Теплопроводность
1.5Вт/м·К
Материал
Hi-Flow 650P
Самоклеящийся
Да
Минимальная рабочая температура
-40°C
Максимальная рабочая температура
+150°C
Торговое название материала
Hi-Flow 650P
Диапазон рабочих температур
-40 → +150 °C
PRICED TO CLEAR
Yes
Страна происхождения
United States
Информация о товаре
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
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P.O.A.
50
P.O.A.
50
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| Количество | Цена единицы |
|---|---|
| 50 - 450 | P.O.A. |
| 500 - 1200 | P.O.A. |
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| 5000+ | P.O.A. |
Техническая документация
Характеристики
Brand
BergquistТолщина
0.001дюйм
Теплопроводность
1.5Вт/м·К
Материал
Hi-Flow 650P
Самоклеящийся
Да
Минимальная рабочая температура
-40°C
Максимальная рабочая температура
+150°C
Торговое название материала
Hi-Flow 650P
Диапазон рабочих температур
-40 → +150 °C
PRICED TO CLEAR
Yes
Страна происхождения
United States
Информация о товаре
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.