Техническая документация
Характеристики
Brand
TE ConnectivityТип соединителя
Гнездо
Для использования с
Корпус миниразъема AMP-IN
Серия
Mini AMP-IN
Minimum Wire Size mm²
0.1mm²
Метод оконцовки
Обжим
Maximum Wire Size mm²
0.4mm²
Minimum Wire Size AWG
26AWG
Покрытие контактов
Олово
Maximum Wire Size AWG
22AWG
Материал контактов
Латунь
Информация о товаре
TE Connectivity Miniature AMP-IN Terminals
These Miniature AMP-IN terminals are designed as mechanical holding devices to enhance the soldering of hookup wires to the PCB. This design eliminates the need for costly manual wire preparation. The wire is accurately positioned and held in place by the AMP-IN terminals to assure proper solder flow and reliable solder joints. A terminal locking lance holds the wire securely in the PCB and insulation support provides strain relief and protects the solder joint. With a low profile height above PCB these AMP-IN terminals offer space saving and design flexibility
TE Connectivity Discrete PCB Connections
тг 223,50
тг 8,94 Each (In a Pack of 25) (ex VAT)
Стандартная упаковка
25
тг 223,50
тг 8,94 Each (In a Pack of 25) (ex VAT)
Информация о наличии не успела загрузиться
Стандартная упаковка
25
Информация о наличии не успела загрузиться
| Количество | Цена единицы | Per Упаковка |
|---|---|---|
| 25 - 475 | тг 8,94 | тг 223,50 |
| 500 - 1850 | тг 8,94 | тг 223,50 |
| 1875 - 7475 | тг 8,94 | тг 223,50 |
| 7500 - 14975 | тг 8,94 | тг 223,50 |
| 15000+ | тг 4,47 | тг 111,75 |
Техническая документация
Характеристики
Brand
TE ConnectivityТип соединителя
Гнездо
Для использования с
Корпус миниразъема AMP-IN
Серия
Mini AMP-IN
Minimum Wire Size mm²
0.1mm²
Метод оконцовки
Обжим
Maximum Wire Size mm²
0.4mm²
Minimum Wire Size AWG
26AWG
Покрытие контактов
Олово
Maximum Wire Size AWG
22AWG
Материал контактов
Латунь
Информация о товаре
TE Connectivity Miniature AMP-IN Terminals
These Miniature AMP-IN terminals are designed as mechanical holding devices to enhance the soldering of hookup wires to the PCB. This design eliminates the need for costly manual wire preparation. The wire is accurately positioned and held in place by the AMP-IN terminals to assure proper solder flow and reliable solder joints. A terminal locking lance holds the wire securely in the PCB and insulation support provides strain relief and protects the solder joint. With a low profile height above PCB these AMP-IN terminals offer space saving and design flexibility
