Техническая документация
Характеристики
Серия
TSW-107-07-L-D-006
Тип комплекта
Сумка специалиста оперативного реагирования
Длина резьбы
17.5мм
Максимальный крутящий момент на выходе
44 нсм
Размеры
210 x 75 x 50mm
Свободная длина
94мм
Материал
Сталь
Brand
CodelockСтрана происхождения
China
Информация о товаре
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers
AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.
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Техническая документация
Характеристики
Серия
TSW-107-07-L-D-006
Тип комплекта
Сумка специалиста оперативного реагирования
Длина резьбы
17.5мм
Максимальный крутящий момент на выходе
44 нсм
Размеры
210 x 75 x 50mm
Свободная длина
94мм
Материал
Сталь
Brand
CodelockСтрана происхождения
China
Информация о товаре
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Double Row Board to Board Vertical Headers
AMPMODU 50/50 double row board to board SMT PCB mount vertical headers with a high density 1.27mm x 1.27mm centerline and a 6.35mm mated height for parallel board to board applications. These AMPMODU 50/50 board to board headers have metallic board holddowns, dual beam receptacle contacts and black UL 94V-0 LCP housings with keying to aid accurate mating.
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.